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School-Enterprise Cooperation to Enlighten the Future | NESY Business Robot Reaches Cooperation with Wuxi Universities
On August 8, the 2025 "Taihu Bay" Alumni Economy Double Recruitment and Double Introduction Cooperation Exchange Conference was grandly held at Wuxi International Conference Center. With the core goal of vigorously developing the "alumni economy", this exchange conference is committed to transforming the "alumni attraction" into a strong driving force for Wuxi's urban development and building an innovative cooperation platform for the work of double recruitment and double introduction. As a key enterprise introduced by the Wuxi (Guangdong-Hong Kong-Macau Greater Bay Area) Innovation Cooperation Center and the Taihu Bay University Innovation and Entrepreneurship Promotion Association, NESY Business Robot was invited to participate in this grand event.
Since its launch in Shenzhen in 2021, NESY Business Robot has quickly risen to the forefront of the industry with its strong development momentum. As an innovative enterprise focusing on the field of semiconductor equipment, the company takes semiconductor molding robots and supporting software as its core track, deeply engages in the whole chain of R&D, production and sales, and is always committed to providing efficient and intelligent automation solutions for the global semiconductor packaging industry, helping the industry's intelligent upgrading.
As an emerging economic development model of new productive forces, the alumni economy is increasingly becoming a key force driving regional economic growth and industrial upgrading. At this conference, the "Wuxi Alumni Economy Development Blue Book" was officially released. The blue book shows that in recent years, Wuxi has successfully built a new development model of alumni economy featuring the organic linkage of "universities + alumni + funds + industries + cities" by continuously cultivating a high-quality environment for alumni to start businesses, relying on its profound foundation of industry-university-research integration and rich advantages in university resources. This has effectively attracted a large number of university alumni talents and high-quality projects to settle down and develop vigorously.
The NESY Business semiconductor molding robot project was introduced by the Wuxi (Guangdong-Hong Kong-Macau Greater Bay Area) Innovation Cooperation Center and Wuxi High-tech Zone. At present, a production base has been built in Hongshan Street, and the scale of existing orders has exceeded 100 million yuan. "Wuxi has a unique innovation and entrepreneurship ecosystem, a solid industrial foundation, and a high degree of attention and friendly atmosphere for talents. We plan to take root here for a long time and strive to reach a scale of more than 1 billion yuan in the next two to three years," said Zeng Hao, Secretary of the Board of Directors of Wuxi NESY Business Robot Co., Ltd., when introducing the future development plan at the conference.
The deepening of this cooperation is expected to release significant value in multiple dimensions: at the level of technological innovation, it is expected to promote major breakthroughs in the field of semiconductor chip packaging, help develop more efficient and intelligent molding robot equipment, and thus effectively enhance the overall competitiveness of China's semiconductor packaging industry; at the level of talent cultivation, it will continuously deliver high-quality professionals with both theoretical literacy and practical ability to the industry, systematically improving the level of the industry's talent echelon; more notably, this school-enterprise collaboration model is expected to become an industry benchmark, thereby driving more enterprises and universities to deepen cooperation, accelerating the in-depth integration of industry, university and research, and injecting lasting momentum into the high-quality development of related industries.
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From March 25 to 27, the 2026 productronica China—Munich Shanghai Electronic Production Equipment Exhibition—made a grand debut at the Shanghai New International Expo Center. Niu’er Commercial Robots showcased its cutting-edge semiconductor encapsulation robot at the show (Booth No.: W4.4328), focusing on the need for end-to-end automation in semiconductor encapsulation. Leveraging its independently developed core technologies, ultra-precise control, and fully customized, end-to-end services, Niu’er provides semiconductor packaging companies with a one-stop smart manufacturing upgrade solution, making it a key highlight in the exhibition’s semiconductor equipment zone.
On March 9, Wuxi High‑Tech Zone held a meeting. “AI+” Three-Year Action Plan Promotion Conference & “AI+Manufacturing” Innovation and Development Summit At the meeting, Niu’er Commercial unveiled its new-generation product— Semiconductor Plastic Seal Robot V5.0 Making its stunning debut and emerging as one of the most closely watched “AI + Manufacturing” new products at the event, it showcased our… Semiconductor Packaging The latest breakthrough in the field of intelligent technology.
Notice Regarding the 2026 Spring Festival Holiday Arrangement
Dear valued customer, hello! As the year draws to a close and a new chapter unfolds, the dragon bids farewell to the old year while the horse leaps into a fresh journey! As the Spring Festival of 2026 approaches, we extend to you our sincerest greetings and best wishes! Based on our company’s actual operational circumstances, we would like to inform you of the following holiday arrangements for the Spring Festival:
The core of the Niu'er commercial plastic encapsulation robot is designed for semiconductor chip packaging and achieves fully automated operations by simulating manual handling processes. The plastic encapsulation robot consists of five major functional modules: 1. Feeding Box and Pre-arrangement Unit: This unit includes a material box turnover mechanism, a sheet-ejection and -transfer module, a sheet-handling and transport module, and a preheating stage module. After operators place multiple material boxes into the system and start the equipment, lead frames are sequentially ejected to the gripping position, where they are then picked up by a sheet-sorting robotic arm and transferred to the preheating stage for heating. The temperature consistency error is within ±10℃. 2. Resin Application and Pre-arrangement Unit: This unit comprises a resin application module, a resin screening module, and a resin pre-arrangement module. Operators load resin into the resin hopper, and after the equipment completes the tasks of arranging resin in the same direction, filtering out waste residues, and sorting out good-quality resin, the resin pre-arrangement mechanism arranges the resin neatly into pre-arranged fixtures for pickup by the main robotic arm. 3. Main Robotic Arm and Main Fixture Unit: This unit includes a high-load collaborative robotic arm and a main fixture module. First, the main fixture picks up the finished products from the encapsulation mold and places them onto the finished-product tray. Then, it picks up the lead frames from the preheating stage and the resin from the resin fixture, sequentially placing them into the mold to complete the loading and unloading operations for the encapsulation mold. 4. Press Mold Cleaning Unit: This unit includes a mold-cleaning module and a high-volume vacuum suction module. After the encapsulation mold is opened and the finished product has been picked up by the main fixture, the cleaning unit uses a combination of rotating brushes and vacuum suction to clean the mold surface. 5. Gluing and Finished-Product Collection Unit: This unit includes a finished-product feeding module, a gluing and cleaning module, a finished-product transfer and transport module, and a finished-product collection module. The main robotic arm picks up finished products from the finished-product tray, places them into the gluing mold for gluing, and then the discharging mechanism picks up the finished products and places them one by one into finished-product clips according to predefined rules. The unit also supports simultaneous discharge capability for multiple clips.
Guride Medical Debuts Smart Moxibustion Robot at the 10th International Moxibustion Conference
The 10th International Moxibustion Conference kicked off grandly at the Wuxi International Conference Center. Gu Rui De Medical showcased its intelligent moxibustion robot at this global event dedicated to the ancient practice of moxibustion. Founded in 2023 and headquartered in Shenzhen, China, Gu Rui De is a leading enterprise specializing in smart therapeutic robots, integrating intelligent algorithms, system development, manufacturing, and sales. The company is committed to delivering high-quality, cutting-edge moxibustion robots to consumers worldwide. Upholding the core philosophy of "Technology + Health," Gu Rui De leverages the latest advancements to make traditional moxibustion therapy safer, more convenient, and highly effective, ensuring customers enjoy a more comfortable and enriching wellness experience.
Gureid Moxibustion Robot | Customer Case Studies
Gu Rui De moxibustion robot customer cases (partial list): Nanshan Science Park | Jiangmen City Physiotherapy Clinic | Shenzhen Municipal Hospital of Traditional Chinese Medicine | Foshan City TCM Health Center As an innovative product that seamlessly integrates traditional moxibustion with cutting-edge smart technology, the Gu Rui De moxibustion robot has earned widespread market recognition for its core advantages, including fully automated moxibustion, intelligent temperature control, automatic smoke purification and scald prevention, as well as personalized therapy plans. These features make it ideal for diverse settings such as rehabilitation centers, chain wellness institutions, and home-based health care routines. #GuRuiDeMoxibustionRobot#MoxibustionTherapyRobot#SmartMoxibustionDevice#MoxibustionRobotCustomerCases
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